| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method by which laminated ceramic electronic components which are free from delamination can be manufactured. SOLUTION: In a method for manufacturing laminated ceramic electronic components, a laminated body is formed by piling up a layer composed mainly of ceramic dielectric powder and another layer composed mainly of Pd powder upon another in one body and the laminated is baked. At the time of baking the laminated body, the laminated body is heated in an atmosphere containing a mixed gas of 1-10mol % H and 99-90mol% N2 until the temperature of the laminated body reaches 700-900 deg.C and, thereafter, the laminated body is baked in the air unlike the conventional method in which the laminated body is baked in the air from the beginning to the end. |
