| 摘要 |
PROBLEM TO BE SOLVED: To reduce an occupied space, facilitate manufacture and enhance reliability in mounting a number of microwave integrated circuits on a microwave circuit board or the like. SOLUTION: A mircowave integrated circuit 1 has a microwave circuit 3, a high-frequency terminal 4a and a DC terminal 4b in the surface of a board 2, and the terminals are connected to a via-hole 5 passing through the board 2. In the rear surface, a high-frequency terminal pad 7a and a DC terminal pad 7b are formed in the state of being connected to the via-hole 5 passing through the board 2, and an earth conductor 6 has a predetermined interval so as not to be brought into electric contact with the terminal pads 7a, 7b. Also, in the microwave integrated circuit 1, the terminal pads 7a, 7b and the earth conductor 6 are mounted on a microwave circuit board 11 so as to make the lower surface. The high-frequency terminal pad 7a of the rear surface, the DC terminal pad 7a and the earth conductor 6 are respectively and correspondingly connected to a high-frequency signal line 12a, a DC bias line 12b and the earth pattern 13 of the microwave circuit board by overlapping each other. |
