| 摘要 |
The heat cracking of a heat-resistant member is predicted by (a) producing a model having a similar shape to that of the heat-resistant member from a photo-set resin having a thermal conductivity of 0.1-0.2 W/mxK, (b) introducing a hot air at a temperature of 50 DEG C. or higher and lower than a softening point of the photo-set resin into the model, (c) measuring a temperature in each portion of the model by a thermal image analyzer, (d) measuring the changes of temperature distribution in the model with time to find whether or not there are overheated portions in the model, and (e) determining the overheated portions as portions in which heat cracking may take place.
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