HIGH DENSE INSTALLATION TYPE PACKAGE USING SEMICONDUCTOR CHIP GROUP CUT FROM WAFER SIMULTANEOUSLY AND ITS PREPARATION

摘要

PROBLEM TO BE SOLVED: To improve reliability and mount many semiconductor chips in limited space by cutting two or more semiconductor chips at a time as one group, and die-bonding them to a board. SOLUTION: A high-density mounting type package is equipped with two or more semiconductor chips 20a and 20b which have a plurality of bonding pads arranged on active faces where predetermined circuit elements are provided, adhesives 25 which bond pattern films 24 having wiring patterns for coupling bonding pads of each semiconductor chips, being attached to the active faces of the semiconductor chips with the said chips 20a and 20b, and package leads 28 which are connected to external elements, being coupled electrically with the pattern films 24. The two or more semiconductor chips 20a and 20b are formed integrally, being cut at a time. Accordingly, in die bonding process, the bonding margin need not be set, so the mounting area of the chip can be reduced.