发明名称 Method of making a multichip module comprising at least one thin film probe
摘要 The present invention relates to the preparation of a multichip module comprising one or more thin film probes. The thin film probes are useful in in situ probe testing of IC chips. An assembly comprising the multichip module and a circuit board having IC chips in a number corresponding to the number of thin film probes is also claimed.
申请公布号 US5630947(A) 申请公布日期 1997.05.20
申请号 US19940365135 申请日期 1994.12.28
申请人 SHI, SHEI-KUNG;TSENG, FU-HSIANG;KUO, CHONG-KAI 发明人 SHI, SHEI-KUNG;TSENG, FU-HSIANG;KUO, CHONG-KAI
分类号 G01R1/067;G01R1/073;(IPC1-7):H05K3/02;H01K3/10 主分类号 G01R1/067
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