| 摘要 |
PROBLEM TO BE SOLVED: To provide the structure of a board having a module property in which an individual part is preliminarily tested before the final assembling of the board and at least some parts can be repaired and also provide its manufacturing method. SOLUTION: In this method, a number of mesas having a conductive upper surface in a substantially single plane and a base plate 12' formed in a pattern- like form are provided. Thin matched dielectric layers 43, 45, 47 49 are formed on the exposed surface of the mesas and a support base, and a conductive material covers a dielectric material filling between the mesas and in the periphery thereof. The upper surface of the mesas and the upper surface of the conductive material are in a substantially identical plane and are insulated from each other by the dielectric material, and the obtained structure is flattened by polishing. Next, multilayered thin film structure 30 for a multi-chip module is formed on electric power distribution structure, and a power source and an earth potential are supplied to a microelectronics part mounted in the surface by using a path passing the thin film structure 30. |
