| 摘要 |
PROBLEM TO BE SOLVED: To reduce the manufacturing cost of laminated electronic component by recycling a carrier film by extracting a sheet without giving any damage to the carrier film. SOLUTION: After a carrier film F is removed from the rear surface of a ceramic green sheet S while the sheet S is held by means of a suction head 2 by suction, the sheet S is carried onto a punching state 4 and held between the head 2 and state 4. Then a piece of a prescribed size is punched from the sheet matrix S with a punching blade 3 and the punched piece Sa is extracted with the suction head 2. Since the film F is removed from the sheet matrix S before the sheet S is punched, the carrier film F is not damaged as in the case of the conventional example. Therefore, the manufacturing cost of laminated electronic components can be reduced by recycling the carrier film F. |
