| 摘要 |
PROBLEM TO BE SOLVED: To facilitate a removal processing of a binder for a ceramic molded body by providing at least one of a through-hole and unevenness in a surface of which at least a ceramic laminate is placed. SOLUTION: A through-hole 4 is provided in a flat plate part 2 and a protruded part 3 of a loading instrument, through which air flows into so that when a chip shaped ceramic molded structure 5 is placed on the loading instrument, the amount of air flowing among the molded structures 5 is increased. For this, a thermal decomposition reaction is likely to be produced and hence the binder can be rapidly removed. Further, a surface of a flat plate part 7 on which the ceramic molded bodies are placed is formed into an uneven shape. Also in the loading instrument 6, air is likely to flow into an uneven part 8 and hence the binder can be rapidly removed. |
