| 摘要 |
<p>PROBLEM TO BE SOLVED: To stabilize the junction between a ceramic substrate and mounted element by detecting the thickness of the substrate for adjusting the lowering amount of a pyramidal collet so as to junction the substrate with a molten solder in optimum depressing amount. SOLUTION: The back of a substrate suction-held by a pyramidal collet 10 on a detector 17 is irradiated with laser beams so that the thickness of the substrate 11 presently suction-held by the pyramidal collet 10 may be detected to store the detected data in a RAM. Next, the substrate 11 is scrabbled to be junctioned with a lead frame. At this time, the lowering amount of the collet 10 is computed by the extrusion amount data from the bottom of the collet 10 detected by the detector 17 to be stored in the RAM. Finally, the junction is completed when the substrate 11 abuts against the lead frame at a specific depression amount to be scrabbled.</p> |
