| 摘要 |
PROBLEM TO BE SOLVED: To provide a plastic molded semiconductor device having a structure wherein wing leads can be arranged without troubles even when the lead pitch is made small, and a manufacturing method of it. SOLUTION: A semiconductor device 14 has an island 16 on which a semiconductor element 20 is mounted, inner leads 18, outer leads 19, and wing leads 17 stretched from the island 16. A lead frame having the wing leads 17 whose tips are not connected with other parts is used. The wing leads 17 are positioned on the plane different from the planes on which the inner leads 18 and the outer leads 19 are positioned. |
