| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element which solves void formation problem of a package body by making the progression of flow head of a formation material constant. SOLUTION: An over molded semiconductor element 30 contains, instead of a conventional flat package body surface, a package body profile with formed contour. Form the section of a semiconductor element, a plastic covering a carrier substrate 14 and a plastic over-molding a semiconductor die 12 are of about constant thickness 36, 38. Alternately, a plastic layer over-molding the semiconductor die is made thicker than a plastic layer covering the carrier substrate. The profile of the package body with formed contour is designed so that, during molding process, the progression of the flow head of molding material is constant, and by applying the same resisting pressure to the flow head of molding material during filing, the voids in the package body are eliminated. |
