METHOD OF USING CERAMIC PRECURSOR POLYMER AS ADHESIVE AGENT OF ELECTRONIC PART

摘要

PROBLEM TO BE SOLVED: To use a ceramic precursor polymer to form ceramic joint between electronic components and a substrate by applying a composition layer including a ceramic precursor polymer containing silicon to the surfaces to be adhered with each other of the electronic components and substrate. SOLUTION: An electronic component has a surface to be adhered to that of a substrate. Next, a layer made of ceramic precursor polymer is applied between the surfaces to be adhered with each other. The surfaces are matched with each other to prepare an assembly provided with the electronic component and substrate. Further, the assembly is heated up to a temperature that is sufficient for the ceramic precursor to be converted into ceramic. Thus, the ceramic precursor polymer can be used for ceramic joint between the electronic component and substrate.