| 摘要 |
PROBLEM TO BE SOLVED: To enable the required time from pick and place of a chip to bonding part to be cut down by individually and movably providing the transfer part such as paste, etc., in a chip holding state from the position near the pick and place part of the chip to the position beneath a bonding tool. SOLUTION: The title bonding device is provided with a chip feeder 5, a transfer part 7 such as paste, etc., a pick and place part 6 delivering the chip from a chip feeder 5 to the transfer part 7 and a bonding part 8. In such a bonding device, the transfer device, the transfer part 7 such as paste, etc., in the chip holding state is to be individually and movably provided from the position near the pick and place part 6 to the position beneath a bonding tool 15. For example, the paste transfer part 7 preparing transfer paste in the state of holding a chip on a transfer table 19 having a squeegee is movably fitted to a chip carrier guide 12 along the same 12.
|
