TAPE CARRIER AND ITS MOUNTING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To arrange a lead which is not contributed to a real junction outside a corner lead in order to prevent a deformation of the corner lead and enhance a manufacturing yield of a tape carrier. SOLUTION: A device hole 16 is formed substantially at a center part of an insulation resin film 15, and an outer lead hole 17 is formed surrounding this device hole 16. On the insulation resin film 15, a plurality of wire patterns 18 are arranged and projected to the device hole 16. The plurality of wire patterns 18 are formed as an inner lead 19, and the outermost side is a corner lead 19'. A positioning mark 21 is arranged at each peak of the device holes 16 and a dummy lead 20 is provided near this positioning mark 21. A length of this dummy lead 20 is formed so as to be shorter than the inner leads 19, 19'.