| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the number of manufacturing processes for a sub-circuit board on which a semiconductor chip is mounted to modify the arrangement pattern of connection pads of the semiconductor chip. SOLUTION: Five board-forming plates 26a-26e for forming a sub-circuit board 25 are bonded in this order on a protective film 24 of a semiconductor chip 21. Thereupon, through holes 28 are formed from openings 27a-27e formed in the respective board-forming plates 26a-26e. Then, electrically conductive paste 31 is injected and filled in the through holes 28. Thereupon, a first connection pad is formed of the electrically conductive paste 31 filled in the opening 27a, and this first connection pad is joined with a connection pad 23 of the semiconductor chip 21. A second connection pad is formed of the electrically conductive paste 31 filled in the opening 27e. The electrically conductive paste 31 filled in the openings 27b-27d forms internal electrically conductive parts.</p> |
