发明名称 |
Electroplating gold alloys and electrolytes therefor |
摘要 |
Disclosed is an electrolyte for the deposition of predominantly gold alloy deposits, a method for the preparation and use of the electrolyte, and an article obtained by such electrodeposition. These electrolytes contain soluble gold and base metal salts, a buffer system effective at pH 4-6, and either a soluble aluminum compound or formate or oxalate ions. Preferably, the electrolyte contains both the aluminum and formate or oxalate ions.
|
申请公布号 |
US4069113(A) |
申请公布日期 |
1978.01.17 |
申请号 |
US19730380804 |
申请日期 |
1973.07.19 |
申请人 |
OXY METAL INDUSTRIES CORPORATION |
发明人 |
CROSSLEY, JOHN ALAN;HACKER NEE WEIMER, VALERIE KATHRYN;CLORLEY, PAUL GRAHAME |
分类号 |
C25D3/48;C25D3/62;(IPC1-7):C25D3/62 |
主分类号 |
C25D3/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|