| 摘要 |
PROBLEM TO BE SOLVED: To prevent lead bending during an assembly step and not to be required for a chip surface protecting potting step. SOLUTION: In a TAB tape body 1, an opening part 3 is formed at locations corresponding to its inner lead bonding (ILB) part groups, and an end part of the ILB part is supported by a marginal part of each opening part 3 of the tape body 1. The ILB part of a lead wire 2 is connected to a bump 6 on a chip 5 in the opening part 3. An opening part 4 is formed at locations corresponding to outer lead bonding(OLB) part groups of the lead wire 2 of the tape body 1 and connected to an external wire part in its interior. A portion inwardly of the opening part 3 of the tape body 1 is covered with a face of the chip 5 to be protected. As a top end of an inner lead is composed of a reinforcing structure supported by the tape 1, lead bending does not occur in an assembly step and a bonding step is excellently performed. Further, a chip surface protecting potting step is not required and an attempt is made to simplify the assembly step. |
