| 摘要 |
PROBLEM TO BE SOLVED: To contrive to enhance adhesion strength of an interlayer insulation resin layer to a wiring conductive layer by a method wherein, after thermoplastic resin is placed on a wiring layer of a base board and the spaces between wires are evacuated, the thermoplastic resin is pressed while thermally deformed and the spaces are filled with the resin, and a step of forming a next wire layer is repeatedly performed. SOLUTION: A base board 100 having a horizontal wiring conductor 101 and a vertical via conductor 102 is formed as a wiring layer. Thermoplastic resin 103 is supplied as an interlayer insulation film to the space 105 between the base board 100 and a die 104. The space 105 between the die 104 and the base board is evacuated from an intake/exhaust port 106. Next, the thermoplastic resin 103 is heated and fed to the space between conductors and/or plated through hole. Pressure is applied to the thermoplastic resin 103 in the die from a lateral direction, and the thermoplastic resin 103 is stacked with the horizontal wiring conductor 101 or the vertical via conductor 102. A wiring layer comprising the other horizontal wiring conductor 108 and a vertical via conductor 109 is formed. |
