| 摘要 |
<p>PROBLEM TO BE SOLVED: To form a multi-layer circuit board with a conductive ink and ease the wire bonding. SOLUTION: A step in which a conductive ink is printed to a pattern space patterned by using a photosensitive insulation layer 20 so as to form a conductive layer is repeated to pile up conductive layers, and a metallic thin film 50 is thermocompression-bonded to an adhesive insulation layer 40 which coats the uppermost part thereof, thin it is etched for pattering. On the other hand, a through-hole 70 whose inside is filled with a conductive substance is formed so that the patterned metallic thin film 50 can be connected electrically with the respective conductive layers. Thus, the circuit board can be manufactured. Since the metallic thin film 50 can keep high flatness different from that of the conductive ink, wire bonding can be easily carried out.</p> |
