| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize a compact size and enable prevention of malfunction due to impact noise. SOLUTION: A light emitting device 13 is die-bonded on a distal end portion of a lead 11 on a light emitting side, and a lead 12 on the light emitting side and the light emitting device 13 are wire-bonded. A phototriac chip 24 of a lateral structure is arranged to face and receive a light from the light emitting device 13. This phototriac chip 24 is die-bonded on an insulating sheet 23 bridged between distal end portions 21c and 22c of a pair of light receiving side leads 21 and 22. The phototriac chip 24 is located between the distal end portions 21c and 22c of the pair of leads 21 and 22. The phototriac chip 24 is wire-bonded with the distal end portions 21c and 22c of the pair of leads 21 and 22. The light emitting device 13 and the phototriac chip 24 are sealed by a mold 31 made of a transparent resin.</p> |
