| 摘要 |
PROBLEM TO BE SOLVED: To improve the soldering performance of a product and to reduce the size of an insulating substrate for miniaturization of the product by forming a recess part at the outer edge part of the opening of a cap case. SOLUTION: A recess part 10b is formed at an outer edge part 10a of the opening of a cap case 10. The size of the part 10b is limited in the inside direction of the case 10 in consideration of the anti-impact strength of the case 10, the swell-out amount of an adhesive, etc., together with the height set at several 10 to 100 and several 10μm, respectively. The part 10b has a square shape in this example and other shapes are also available as long as they can absorb the swelled-out adhesive 9. Then it is not required to form the part 10b at the entire part 10a of the case 10 and also effective to form the part 10b only at the peripheral parts corresponding to the side electrodes 2d, 2e and 2f of the case 10. Furthermore, the part 10b can also be formed at the inner edge part of the case 10.
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