| 摘要 |
PROBLEM TO BE SOLVED: To lessen the warpage of a substrate in a stage for forming a thin-film magnetic head element and to prevent the peeling of the thin films of respective layers and the deterioration in the characteristics thereof by forming compensation thin films for relieving the camber of the substrate on the rear surface of the substrate. SOLUTION: A ground surface layer 21 of about 10μm thickness consisting essentially of Al2 O3 , the thin-film magnetic head element 3 consisting of various kinds of the thin-film layers and a protective layer 4 of about 30μm thickness consisting of a material constituting. Al2 O3 as its essential component are formed on the surface of the substrate 1 consisting of a material contg. Al2 O3 -TiC as its essential component and having about 2mm thickness. The compensation thin film 22 consisting of the material contg. the Al2 O3 as its essential component and having about 10μm thickness is formed on the rear surface of the substrate 1. The Al2 O3 film on the rear surface side is merely necessitated to be formed in the state of applying a photoresist 5, etc., of about 4μm thickness on the front surfaces side of the substrate when the substrate formed with the Al2 O3 film only on the front surface side and formed with the polished front surface is previously prepd.
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