| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of a defect by an epoxy tail which is the residue of Ag-epoxy in a die attaching process adopting a dotting method by instantaneously lowering the viscosity of an applied epoxy adhesive. SOLUTION: A semiconductor chip is attached to the pad 16 of a lead frame 14 having the pad 16 to which the semiconductor chip is stuck with an epoxy adhesive 20. In such a die attaching process, the occurrence of epoxy tails is prevented by instantaneously lowering the viscosity of the applied adhesive 20 at the time of applying the adhesive 20 to the pad 16 of the lead frame 14. For example, air heated to 50-70 deg.C is blown upon Ag-epoxy dotted on the die pad 16 through a tube 10. When the air is blown, the viscosity of the Ag- epoxy instantaneous drops to <=30 poise and the occurrence of epoxy tails is suppressed. |
