发明名称 MULTI-CHAMBER DEVICE AND ITS WAFER INSPECTING METHOD
摘要 PROBLEM TO BE SOLVED: To calculate the deviating of a transparent or silicon dummy wafer by providing a wafer carrying accuracy detecting means for a wafer carrying chamber. SOLUTION: A wafer carrying accuracy detecting means 7 is constituted of a light source 8 which projects light upon a transparent dummy wafer 4 and a transparent blade 5 before and after the blade 5 is moved, an image receiving section 9 composed of a camera, etc., which takes the pictures of the wafer 4 and blade 5, an output section 10 composed of a monitor, etc., which displays the pictures taken by means of the section 9 and has ruled lines 22, and an arithmetic section 12 which calculates the deviation of the wafer 4 from the blade 5 based on a coincident point and provided for a wafer carrying chamber 2. Since the scale of the blade 5 is marked as the vernier of the ruled lines of the wafer 4, the carrying accuracy of the wafer 4 can be improved by detecting the positional deviation of the wafer 4 on the blade by utilizing the vernier.
申请公布号 JPH09129701(A) 申请公布日期 1997.05.16
申请号 JP19950285085 申请日期 1995.11.01
申请人 HITACHI LTD 发明人 ISHIKAWA KATSUHIKO;TANABE YOSHIKAZU;ITO MASAKI;ITO HIDEFUMI
分类号 H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/677
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