| 摘要 |
<p>PROBLEM TO BE SOLVED: To dissipate heat of semiconductor elements arranged on the front surface of a print board efficiently to the rear surface of the same. SOLUTION: A heat pipe type heat sink is provided with a heat absorbing plate 2, provided on the rear surface side of a print board 100, heat absorbing projections 6, formed on the heat absorbing plate 2 so as to be inserted into holes 108 on the board from the rear surface side of the print board 100, and a heat pipe 4, connected thermally to the heat absorbing plate 2 to transfer the heat of the heat absorbing plate 2 to a heat radiating unit. Heat, generated from semiconductor chips 106, arranged on the front surface of the print board 100, is transferred to a copper plate layer of the through holes 108 of the print board 100, next, the heat is transferred to heat absorbing projections 6, inserted into the through holes 108, and the heat is transferred sequentially to the heat absorbing plate 2 and the heat pipe 4.</p> |
