| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the contact resistance between an overcurrent detection resistance and a mounting substrate and reduce a common difference in a detection current by a method wherein a thick film conductor formed by printing and sintering is used as the overcurrent detection resistance. SOLUTION: In a structure of an overcurrent detection circuit 10, a wire for electrically connecting a transistor 10A, a resistor 10B and an overcurrent detection resistor 10C to each other is formed on a common ceramic substrate by printing and sintering a same thick film conductor. By using the thick film conductor as the overcurrent detection resistor 10C, it is possible to reduce the tolerance of a resistor value of the overcurrent detection resistor 10C within about±1%, decrease a contact resistance between the overcurrent detection resistor 10C and a mounting substrate, and as a result, reduce the tolerance of a detection current 10E.</p> |
