发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent cracking of a resin case and realize a package structure of high reliability whose thermal resistance is small, by making a sectional shape in the axial direction of a metal cylinder for attaching a package which is arranged on an encapsulation resin case, an S-shape. SOLUTION: An S-shaped metal cylinder 3a is buried in resin 8 of a resin case 1, a surface in contact with a metal base 2 of the S-shaped metal cylinder 3a is protruded from the surface of the resin 8, and the height of the protrusion part 25 (a gap between the resin case 1 and a metal base 2) is about 0.2-0.3mm. A cavity part of the S-shaped metal cylinder 3a and a through hole of the metal base 2 become a fixing hole 21. Since the left side sectional shape out of sections in the axial direction of the cylinder is an S-shape, the metal cylinder 3a is called an S-shaped metal cylinder. By applying the S-shaped structure, adhesion with the resin 8 is increased without knurling. Since the S-shape machining is enabled by continuous drawing, the manufacturing cost is low, and mass production is enabled.
申请公布号 JPH09129823(A) 申请公布日期 1997.05.16
申请号 JP19950280047 申请日期 1995.10.27
申请人 FUJI ELECTRIC CO LTD 发明人 YAMADA TOSHIFUSA
分类号 H01L25/07;H01L23/12;H01L25/18 主分类号 H01L25/07
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