| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resin sealed semiconductor device comprising a low thermal resistance package capable of realizing low cost, high reliability, and to provide a manufacturing method thereof. SOLUTION: This present semiconductor device has an island 14 mounting a semiconductor element 13, a lead frame 22 having an inner lead 15 and a drop-in heat spreader 19 sealed in resin 18. Among components of the lead frame 22, the island 14 and a power supply or ground inner lead are connected to the drop-in heat spreader 19 through a metal plating 20 having a low melting point.</p> |
