| 摘要 |
PROBLEM TO BE SOLVED: To make a multilayer wiring board excellent in external appearance and reliability. SOLUTION: In a build-up multilayer printed wiring board where an interlayer insulating layer 4 consisting of an active adhesive is provided between an inner copper pattern 3, which has a fine uneven layer 9 at the surface, and an outer copper pattern 6, the surface of the uneven layer 9 of the inner copper pattern 3 is covered with a metallic layer, which contains metal where the tendency of ionization is larger than that of copper and besides smaller than that of titanium, one kind or more, or a noble metal layer 10. |
