MANUFACTURE OF SEMICONDUCTOR DEVICE AND LEAD FRAME WHICH IS USED IN THE MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To prevent a large stress from being applied between resin and an insulating tape for a deformation preventing part, by forming a slit along the central part of the insulating tape for deformation preventing part where the tape is stuck on a lead pitch expanding part outside the outer leads of leads. SOLUTION: A deformation preventing part 30 is formed by injecting resin, with transfer molding, into the upper side and the lower side of an insulating tape 25 for the deformation preventing part, while using a lead frame 10 wherein a slit 26 is formed along the central part of the insulating tape 25 for the deformation preventing part where the tape is stuck on a lead pitch expansing part 18 outside outer leads 17 of leads 3. Thereby a large stress is not applied between the resin and the insulating tape 25 for the deformation preventing part, and the tape 25 is not peeled from the leads 3 and deformed. Hence electric characteristics can be precisely and surely measured.