发明名称 STYRENE RESIN FOAMING MATERIAL AND HEAT INSULATING MATERIAL USING THE SAME FOR CONSTRUCTION
摘要 <p>A styrene resin foaming material has a density ς of 0.02-0.008 g/cm3, a melt tension of the styrene resin of 5-40 gf. The relation between an average cell diameter d(νm) and the density ς is given by (1). The relation between a thermal conductivity μ(kcal/m.h. °C) and the density ς is given by (2): μ ≤ 0.0001 x 1/ς + 0.023. Accordingly, the styrene resin foaming material has a low material conductivity and excellent heat insulating property in spite of a low density (high ratio expansion foam) thereof.</p>
申请公布号 WO1997017396(P1) 申请公布日期 1997.05.15
申请号 JP1996003258 申请日期 1996.11.07
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