发明名称 |
Electrical flexible circuit board |
摘要 |
The circuit board has two carrier layers of polyamide material 1,2 and both outer surfaces are copper layers. At specific locations through hole connections 4 are formed .Electrical connections can be formed at these points with the use of solder pads 8. Located between the carrier layers is a heating conductor 9 that has a ring shape around a solder pad region. When the conductor is heated the solder pad melts to make the connection.
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申请公布号 |
DE19542165(A1) |
申请公布日期 |
1997.05.15 |
申请号 |
DE19951042165 |
申请日期 |
1995.11.11 |
申请人 |
WUERTH ELEKTRONIK GMBH & CO. KG, 74676 NIEDERNHALL, DE |
发明人 |
PAUL, HARALD, 74653 KUENZELSAU-GAISBACH, DE |
分类号 |
H05K1/02;H05K1/16;H05K3/34;H05K3/42;H05K3/46;(IPC1-7):H05K3/34 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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