发明名称 Electrical flexible circuit board
摘要 The circuit board has two carrier layers of polyamide material 1,2 and both outer surfaces are copper layers. At specific locations through hole connections 4 are formed .Electrical connections can be formed at these points with the use of solder pads 8. Located between the carrier layers is a heating conductor 9 that has a ring shape around a solder pad region. When the conductor is heated the solder pad melts to make the connection.
申请公布号 DE19542165(A1) 申请公布日期 1997.05.15
申请号 DE19951042165 申请日期 1995.11.11
申请人 WUERTH ELEKTRONIK GMBH & CO. KG, 74676 NIEDERNHALL, DE 发明人 PAUL, HARALD, 74653 KUENZELSAU-GAISBACH, DE
分类号 H05K1/02;H05K1/16;H05K3/34;H05K3/42;H05K3/46;(IPC1-7):H05K3/34 主分类号 H05K1/02
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