| 摘要 |
<p>An acoustic probe and a method for making same are disclosed. The probe includes a novel interconnection network consisting of two portions, i.e. a first portion (1) in which MxN conductive paths have a section contacting MxN piezoelectric transducers and are arranged at a pitch (PN) in direction (Dx) and at a pitch (PM) in direction (Dy) within the acoustic absorption material; and a second portion (2) in which the MxN conductive paths are arranged on M dielectric substrates spaced apart at a pitch (P'M) and each provided with N paths arranged at a pitch (P'N). A method for making said acoustic probe is also disclosed. The dielectric substrates may advantageously be flexible printed circuits optionally including chips.</p> |
