| 摘要 |
A thermoconductive module in which is placed a device under test (DUT). The DUT is placed in a tester and the thermoconductive module engages the DUT. A load is applied to the DUT. A heat exchange fluid flows through the thermoconductive module. The thermoconductive module maintains the temperature of the DUT constant while being tested. The face of the thermoconductive module which contacts the DUT is flexible such that it conforms to the surface of the DUT. |
