Heat conductive material and method for producing the same

摘要

A heat conductive material of high thermal conductivity contains a metal or an alloy which is liquid at room temperature or a fine powder of a heat conductive material dispersed in an organic material which is liquid at room temperature and is used as a cushioning contact material between electronic parts or a circuit substrate carrying electronic parts thereon and a cooling device for cooling the electronic parts or circuit substrate with electronic parts thereon.