SUSPENDED MICROSTRUCTURES

摘要

A suspended microstructure process assembly includes a first microstructure assembly, with a temporary substrate having a first surface and a first microstr ucture fabricated on the first surface; a second microstructure assembly, including a f inal substrate having a second surface and a second microstructure fabricated on the second sur face; connecting elements for joining the first microstructure assembly to the second microstructure assembly with a predetermined separation and alignment; and a rem ovable bond temporarily securing the first microstructure assembly to the second micros tructure assembly until the temporary substrate is removed. The connecting elements may b e electrically conductive contacts or electrically nonconductive spacers. Electric ally conductive contacts may be supplied to the first microstructure from a back side of the first microstructure assembly. The first microstructure fabricated on the first surfac e may incorporate a removable layer to enable multiple level suspended structures.