| 摘要 |
A high-performance low-cost functional module package is provided that handles microwaves or millimetre waves. The package comprises a laminated structure made up of a plurality of dielectric, e.g. ceramic, substrates 31, 32, 33, signal channels (25, 28) connected to signal conductors that are formed on one of the dielectric substrates and ground channels (24, 26, 27, 29) connected to ground conductors that are formed on another of the dielectric substrates. The channels are formed on side faces of the dielectric substrates and serve as terminals. Each pair of the ground channels (24 and 26, or 27 and 29) is arranged on opposite sides of a corresponding one (25 or 28) of the signal channels. The terminals are positioned between parts of the package to be connected to an external circuit board and the signal and ground conductors. The package may be used for a FET or capacitor and it is made airtight. |
