| 摘要 |
A parasitic capacitance which is generated in a metal line by a molding compound material (38) is calculated, and defects which are caused by the parasitic capacitance is overcome by analyzing the calculated parasitic capacitance. The parasitic capacitance caused by the moulding material may be eliminated by ensuring that the thickness of the passivating layer (34) is greater than the height of the metal conductors (32), thus preventing the moulding material from encroaching between adjacent metal conductors. |
