发明名称 |
INJECTION MOLD APPARATUS AND MANUFACTURE OF RESIN MOLDING |
摘要 |
PROBLEM TO BE SOLVED: To provide a mold apparatus for injection molding or injection compression molding for improving the transferability of the surface shape of a molding and a method for injection molding. SOLUTION: This mold apparatus comprises a metal layer formed on the cavity surface of an injection mold via a heat insulator layer. The thickness of the metal layer is 0.1 to 5mm, the thermal conductivity of the heat insulator is 1.0×10<-4> to 9.0×10<-4> cal/sec.cm.degree and the thickness of the insulator layer is 10 to 130μm in the mold apparatus. This method for manufacturing a resin molding is one whereby the molding is obtained by injection molding or injection compression molding resin by using the apparatus. |
申请公布号 |
JPH09123223(A) |
申请公布日期 |
1997.05.13 |
申请号 |
JP19950281005 |
申请日期 |
1995.10.27 |
申请人 |
MITSUBISHI RAYON CO LTD |
发明人 |
MASUDA SEIJI;NAKANISHI HIROSHI;TAKAHASHI HARUNORI;KOGAME AKIYOSHI |
分类号 |
B29C33/38;B29C33/42;B29C45/26;B29C45/37;B29K105/32;B29L17/00;G11B7/26;(IPC1-7):B29C45/26 |
主分类号 |
B29C33/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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