发明名称 INJECTION MOLD APPARATUS AND MANUFACTURE OF RESIN MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a mold apparatus for injection molding or injection compression molding for improving the transferability of the surface shape of a molding and a method for injection molding. SOLUTION: This mold apparatus comprises a metal layer formed on the cavity surface of an injection mold via a heat insulator layer. The thickness of the metal layer is 0.1 to 5mm, the thermal conductivity of the heat insulator is 1.0×10<-4> to 9.0×10<-4> cal/sec.cm.degree and the thickness of the insulator layer is 10 to 130μm in the mold apparatus. This method for manufacturing a resin molding is one whereby the molding is obtained by injection molding or injection compression molding resin by using the apparatus.
申请公布号 JPH09123223(A) 申请公布日期 1997.05.13
申请号 JP19950281005 申请日期 1995.10.27
申请人 MITSUBISHI RAYON CO LTD 发明人 MASUDA SEIJI;NAKANISHI HIROSHI;TAKAHASHI HARUNORI;KOGAME AKIYOSHI
分类号 B29C33/38;B29C33/42;B29C45/26;B29C45/37;B29K105/32;B29L17/00;G11B7/26;(IPC1-7):B29C45/26 主分类号 B29C33/38
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