发明名称 METHOD AND EQUIPMENT FOR MACHINING SUBSTRATE USING CO2 GAS LASER BEAM
摘要 PROBLEM TO BE SOLVED: To provide a method and a device for machining a substrate capable of suppressing the temperature rise of the cooling water, and keeping the output of the CO2 gas laser beam to be constant. SOLUTION: In a substrate machining method using the CO2 gas laser beam, 4-20% of the CO2 gas laser beam A outputted from a resonator 4a on the output side is reflected by a mirror 10 for detecting the monitor beam which is provided in a tilted manner relative to the optical axis between the resonator 4a and a condensing lens 17, and a substrate 19 is machined while the CO2 gas laser beam R which is reflected on the surface of the mirror 10 for detecting the monitor beam is constantly monitored by a monitor beam detecting means 11.
申请公布号 JPH09122946(A) 申请公布日期 1997.05.13
申请号 JP19950283575 申请日期 1995.10.31
申请人 HITACHI CABLE LTD 发明人 IMOTO KATSUYUKI
分类号 B23K26/00;B23K26/02;B23K26/03;B23K26/12;B23K26/40;H01S3/00;H01S3/041;H01S3/134;H05K3/00 主分类号 B23K26/00
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