| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a low thermal expansion alloy sheet for electronic parts, free from the occurrence of inferior etching, such as striped irregularity, and capable of high precision etching. SOLUTION: This alloy sheet is a low thermal expansion alloy sheet for electronic parts, excellent in etching characteristic, which is composed of an Fe-Ni alloy containing 32-38wt.% Ni or an Fe-Ni-Co alloy containing 23-38wt.% Ni and <=7wt.% Co and satisfying Ni+Co=30 to 38wt.% and in which the relationship between the ratio (%) of degree of orientation of the (100) crystal plane with respect to the rolling plane and the microsegregation ratio (%) of Ni with respect to the direction orthogonal to the rolling direction in the plane to be etched lies within the range not higher than the lines connecting the points A(0,4), B(50,4), and C(100,3) in the coordinates taking the former as abscissa and the latter as ordinate. This alloy sheet can be used as a starting sheet for the product in which the pitch of pit by etching exceeds 300μm.</p> |
