发明名称 METHOD FOR RECOVERING AND GRANULATING WASTE RESIN MOLDING
摘要 <p>PROBLEM TO BE SOLVED: To recover and granulate at low cost by separating and removing the metal film from a resin material by a relatively simple and ready method with respect to waste resin molding with a metal film formed on one or both surfaces. SOLUTION: After a resin molding is crushed into a plurality of small pieces to be treated 12, by heating these small individual pieces to be treated 12, these small pieces to be treated 12 are rendered reducible. With respect to these heated small pieces to be treated 12, compression impact forces based on microvibration are imparted to collapse them, so that since the resin material is extended thin and the metal film is not extended at all, the material and metal film are rubbed in their interface, as a result, separation takes place between the resin material and the metal film, thereby forming flat small pieces to be treated 13. As the flat small pieces to be treated 13 are given impact milling forces, the metal film is separated from the resin material, and the resin material is ground and graded, thus forming resin material 14 to be recovered.</p>
申请公布号 JPH09123167(A) 申请公布日期 1997.05.13
申请号 JP19950279233 申请日期 1995.10.26
申请人 AIN ENG KK 发明人 NISHIBORI SADAO
分类号 B09B3/00;B29B9/12;B29B13/10;B29B17/00;B29K105/26;G11B7/26;(IPC1-7):B29B17/00 主分类号 B09B3/00
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