发明名称 RESIN COMPOSITION FOR MICROWAVE FUSION
摘要 <p>PROBLEM TO BE SOLVED: To provide a resin composition for microwave fusion which gives high quantity of heat with high heat exchange rate, enables fusion bonding without being influenced by the state of deterioration of resin and provides high fusion bonding strength. SOLUTION: This resin composition consists of 100 pts.wt. thermoplastic resin, 5-100 pts.wt. fine conductive aniline polymer particles and 0.01-20 pts.wt. titanate coupling agent and/or aluminum-base coupling agent. The fine conductive aniline polymer particles are surface treated beforehand with 0.01-10 pts.wt. titanate coupling agent and/or aluminum-base coupling agent.</p>
申请公布号 JPH09124953(A) 申请公布日期 1997.05.13
申请号 JP19950287325 申请日期 1995.11.06
申请人 SEKISUI CHEM CO LTD 发明人 YAMAMOTO KAZUYOSHI;MURASHIMA MASATOSHI
分类号 H05B6/64;B29C65/14;C08K5/56;C08L101/00;(IPC1-7):C08L101/00 主分类号 H05B6/64
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