SOLDER-HOLDING CLIPS FOR APPLYING SOLDER TO CONNECTORS

摘要

An array and method of forming an array of solder-holding clips (17) is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins (33) of an electrical device, for soldering such pins (33) directly to the conductive pads (41) or internally plated holes (35) of a substrate, or to provide a lead connecting such pins (33) to a substrate.