Machine for wire cutting ceramic, glass or silicon workpiece

摘要

A cutting machine has: (a) a wire which is carried by rolls mounted on a frame and which has a workpiece cutting region extending between two rolls; (b) a container which holds cutting liquid to be applied onto the workpiece and wire during cutting and which has a max. filling level-defining upper edge located below the wire cutting region; and (c) equipment for fastening the workpiece to the frame above the wire cutting region such that, when the workpiece contacts the wire for cutting, it deflects a portion of the cutting region into the container so that cutting is effected within the cutting liquid. Also claimed is a method of cutting a workpiece using the wire cutting machine comprising arranging the container such that the cutting liquid level is immediately below the wire cutting region and deflecting the wire downwards into the cutting liquid by lowering the workpiece into contact with the cutting region so that the cutting liquid is continuously supplied to the workpiece during cutting by the wire.