| 摘要 |
Assembling of electronic modules for smart cards, using integrated circuits (30) with protuberances (33), involves: (a) making regularly spaced groups (20) of through holes (12) on an insulating sheet substrate (10), each group being associated with a module and the holes destined to be filled with conductive material to form the connection between the faces of the substrate, which on one side receive the electrical contacts (13) of the external connection and on the other side the printed circuit (14) on which the integrated circuit (30) with protuberances (33) will be mounted; (b) an initial printing stage by depositing conductive ink on the first side of the sheet (10) to make the electrical contact and partially fill the holes (12); (c) a second printing stage to form the printed circuit (14) and to completely fill the holes (12); (d) mounting, on the second face of the substrate, the integrated circuit with protuberances on the printed circuit. Between step (c) (second printing) and step (d) (mounting) is included to step to deposit, around the printed circuits (14), a material of a reactable epoxy resin, hot melt adhesive or thermoplastic weldable with ultrasonics, to join the electronic module to the substrate, The sheet (10) is a thermoplastic compatible with the card material. The conductive ink is a silver or organometallic loaded polymer. The protuberances (33) are made of a polymer conductor. |
