The lead-frame and the semiconductor element (2) are sealed in a resin, while a section of the frame supported island (11) is fitted with a number of through holes (15). The semiconductor element is coupled to the island by a film (12) made of a resin. Preferably the film has a first dimension of each side of at least by 0.5 mm, or more, shorter than a second dimension of the semiconductor element. Typically, the through holes are close together with spacing of 1.0 mm or less.
