发明名称 Electronic component and method for producing the same.
摘要 An electronic component of the present invention includes a first substrate, a second substrate, a first conductive layer constituting a terminal electrode on a first surface of the first substrate, and a first insulating layer formed on the first conductive layer, wherein the first insulating layer and the second substrate are directly bonded to each other by at least one bond selected from the group consisting of a hydrogen bond and a covalent bond.
申请公布号 EP0651449(A3) 申请公布日期 1997.05.07
申请号 EP19940117186 申请日期 1994.10.31
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 EDA, KAZUO;TOMITA, YOSHIHIRO;KANABOSHI, AKIHIRO;SUGIMOTO, MASATO
分类号 C04B37/00;H01L21/02;H01L27/12;H01L41/04;H01L41/18;H03H3/02;H03H3/08;H03H9/10;H03H9/17;H03H9/25 主分类号 C04B37/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利