| 摘要 |
The method according to the text of the application consists in providing the body (1) of the card with a cavity (2) and with a conduction area (5) situated partly in the cavity (2) and partly outside it; in inserting an fixing the integrated circuit (3) in the cavity (2) in such a way that its solder pads (4, 4a) are turned outwards; in forming by deposition a first layer of dielectric varnish (6) on the integrated circuit (3), with the exception of the solder pads (4, 4a) of the latter, and on part of the body (1) which surrounds the cavity (2), with the exception of an area (7) situated immediately in line with the conduction area (5); in forming read/write contacts (9, 9a) as well as the conductors (8) linking these latter to the respective solder pads (4, 4a) of the integrated circuit (3) by deposition of a conducting ink on the said solder pads (4, 4a), on the first layer of varnish (6), and on the part which is not coated with varnish of the conduction area (5) so that it is linked to one of the conductors; and in forming by deposition a second layer of dielectric varnish (10) on the parts of the ink deposit which do not constitute the read/write contacts (9, 9a). <IMAGE> |
