发明名称 |
Vertical wafer compact flip chip feeder |
摘要 |
<p>A vertical wafer compact flip chip feeder device includes a loading station for providing a loading location where a flip chip wafer having first and second planar surfaces is received such that the first and second planar surfaces are substantially perpendicular to a first plane. The flip chip feeder device further includes a pick-up station for providing a pick-up location where individual flip chips are retrieved from the flip chip wafer. A wafer translating assembly translates the flip chip wafer between the loading and pick-up stations with the first and second planar surfaces of the flip chip wafer remaining substantially perpendicular to the first plane. A chip pick-up assembly retrieves the individual flip chips from the flip chip wafer at the pick-up station and flips the individual flip chips to a flipped position such that first and second planar surfaces of the individual flip chips are substantially parallel with the first plane. <IMAGE></p> |
申请公布号 |
EP0772229(A2) |
申请公布日期 |
1997.05.07 |
申请号 |
EP19960202731 |
申请日期 |
1996.09.30 |
申请人 |
DELCO ELECTRONICS CORPORATION |
发明人 |
COMBS, CHRISTOPHER DAVID;BAKER, ANDREW RUSSELL;DAVIDSON, STEVEN LEE;REZSONYA, THOMAS CARL |
分类号 |
B65G49/07;H01L21/00;(IPC1-7):H01L21/00 |
主分类号 |
B65G49/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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